Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks
Publisher: Prentice Hall International

By simultaneous I/O design planning and FPGA placement by both the teams important objectives like meeting of overall timing (both FPGA in-chip and on board), meeting of PCB signal integrity constraints, less number of PCB layers and less PCB area can be achieved. This week, Mentor Graphics released HyperLynx PI, a design software program aimed at improving power integrity on the PCB. The FPGA I/O design and placement of FPGA on PCB. Power has Noise, voltage drop along traces, current density variation, and other problems occur. Later we would include an external flash memory Power supply and signal integrity issues depend on the frequencies you'll be operating at and also the I/O standards you're using. They selected the Mentor Graphics HyperLynx technology, widely adopted at many PCB design sites, as their robust signal and power integrity solution. Several of these issues can be . PCB design is mostly about signal integrity, controlled impedance lines, EM coupling, and supply decoupling. But using multiple FPGA implies multichip design and there are several issues which need to be taken care. For backplane designs, the most common form of Smaller vias and tighter pitch driven by large pin count BGA packages makes back-drilling impractical in these applications; due to drill bit size and tolerance issues. I don't know of a good reference that addresses all the issues. With 2 comments · image Vias make electrical connections between layers on a printed circuit board. The thicker the PCB, the more vias become transmission-line stubs that degrade signals because they can radiate interference and cause signal reflections. As a world-class semiconductor company, Fujitsu Semiconductor needed to address timing issues at three levels: LSI, PKG, and PCB, especially with the rapidly emerging DDR2/3/4 and SERDES interconnect standards. Innovative Signal Integrity & Backplane Solutions (by Bert Simonovich) PCB Vias – An Overview. They can carry signals or power between layers. John Isaac The HyperLynx PI tool was created for designers to evaluate and mesh these power requirements, reducing the need for decoupling capacitators, shortening design times and eliminating respins, and improving signal integrity. My goal is to build a PCB with an EP3C120 and being able to download a configuration (initially using a .sof file through USB Blaster) to the fpga and connect some of the IO pins to some headers on the PCB, research and testing purposes only.